The equipment has an Xray imaging system, a four-axis robot automatically loads and unloads materials, and performs online fully automatic inspection for discrete components in the semiconductor industry.
The equipment has an Xray imaging system, a four-axis robot automatically loads and unloads materials, and performs online fully automatic inspection for discrete components in the semiconductor industry. It can adapt to 7-inch, 11-inch, and 13-inch trays. The equipment emits X-rays through the Xray generator, penetrates the inside of the chip, and the flat-panel detector receives the X-rays for imaging. The image is analyzed and judged through the image algorithm to determine good and bad products, and the serial number of the chip in the tray is determined through the re-disk function, so that the bad chips can be picked out in the subsequent process.
2. Product functions
(1) Separate component loading and unloading docking method
A. Stacking loading and unloading of trays, with AGV trolleys reserved for automatic loading and unloading
B. Loading and unloading through conveyor belt
C. Loading and unloading of blister boxes/cassettes
(2) Four-axis robot loading and unloading, meeting the universality of loading and unloading of 7-inch, 11-inch and 13-inch trays
(3) The barcode scanner automatically identifies the batch, quantity and other production information contained in the barcode or QR code and forms a list to be presented on the industrial computer for easy access and review at any time
(4) The CCD imaging system automatically identifies the position of the label, automatically associates the X-Ray imaging results, and can make marks corresponding to poor X-Ray imaging in the blank space of the label
(5) The X-Ray imaging system adopts a matrix operation mode to achieve high-definition imaging of large-size trays, and automatically replays according to the imaging picture to present a complete tray image
3. Product features
Powerful algorithm software
(1) The self-developed replay algorithm can replay in real time while collecting images.
(2) Rich human-computer interaction functions. The interface image can be dragged and scaled. You can double-click the NG chip on the re-disk image to index and display the original image, NG type and other information of the chip.
(3) The self-developed detection algorithm can automatically and accurately detect defective items such as chip line type and foreign matter.
(4) The software has functions such as code scanning, MES upload, and manual re-judgment.
High detection efficiency
Matrix-type image acquisition for the entire tray, no need to pull or coil the material; with CCD visual positioning system, the robot automatically loads the material. 7-inch tray detection time
Production line docking
It has the function of docking with AGV, conveyor line docking and cassette automatic discharge.
Result output
According to the detection items and the corresponding detection results, the defective products and detection item lists, the corresponding defective product location list, and the defective product rate list are output.
Safety and environmental protection
The entire equipment is safety interlocked, with triple protection functions, and any part of the body surface meets the safety radiation standard of radiation safety value ≤1usv/h.
Application range
●Electronic circuit board inspection
●Casting product inspection
●Weld and pipeline inspection
●Metrology and mapping
●3D CBCT
●Material research
●Aerospace, automobile production and electronic product production quality control
Technical parameters | ||
Imaging system | Light tube voltage | 130KV |
Light tube | Closed type | |
Detector | HD FPD | |
Imaging method | 2.0D | |
Detection range | Product state | Coiled material |
Reel thickness | 5-15mm | |
Detection size | 7-13 inch coil | |
Detection type | Discrete components | |
IC internal foreign matter (metal wire, extra wire, extra die) | IC linear defects (collapsed wire, wire swing, tight wire, high wire arc, low wire arc, flat top, flying wire, less wire, broken wire, etc.) | |
Safety standards | International radiation safety standards | ≤1μSV/hr |
Other parameters | Dimensions/weight | 3000Kg |
Power supply | AC220V /50Hz |