In the field of industrial inspection, accurate and efficient defect identification is the key to ensuring product quality. The XG5010A X-ray detection equipment launched by Zhengye Technology innovatively integrates intelligent AI ultra clear algorithm and advanced X-ray transmission technology, redefining the standards of industrial detection and providing a revolutionary solution for quality control in multiple industries.
Empowered by intelligent AI algorithms, detection accuracy is further upgraded
The core breakthrough of XG5010A lies in its intelligent AI ultra clear algorithm system:
Deep learning defect recognition: automatically recognizes more than 30 common defects including bubbles, cracks, foreign objects, etc., with an accuracy rate of up to 99.7%
Adaptive image optimization: AI real-time optimizes imaging parameters, automatically adjusts for different materials and thicknesses, ensuring that all types of products can achieve the best detection results
Intelligent data analysis: Automatically generate SPC statistical reports, monitor production quality trends in real-time, and warn potential risks in advance
The equipment adopts military grade hardware configuration:
High precision radiation source: Closed 90KV microfocus radiation source with a minimum focal size of 5 μ m to ensure imaging clarity
Ultra clear flat panel detector: 1536 × 1536 pixel matrix, pixel size 85 μ m, spatial resolution 5.8lp/mm
High speed imaging system: With a maximum frame rate of 40fps, it meets the detection requirements of high-speed production lines
Multi functional stage: capable of bearing up to 10KG, supporting a standard detection range of 500 × 500mm, with optional special functions such as rotation and tilt
XG5010A, with its outstanding performance, has successfully served multiple key industries:
In the field of new energy: precise detection of defects such as alignment of lithium battery electrodes and internal wrinkles of battery cells
Semiconductor industry: Identify issues such as micro scale circuit breakage and solder joint virtual soldering inside chips
Electronic manufacturing: comprehensive inspection of PCB board through holes and internal structure of electronic components
Automotive Electronics: Ensuring the reliability of critical components such as connectors and wiring harnesses
Consumer electronics: providing comprehensive internal structure analysis for mobile phones and smart wearable devices
XG5010A, with its innovative intelligent AI ultra clear algorithm, is leading industrial inspection into a new era of intelligence, providing strong quality assurance for “Made in China”. This device not only significantly improves detection efficiency and accuracy, but also lays a solid foundation for the digital transformation of the enterprise’s quality control system.
