With the continuous advancement of semiconductor chip manufacturing technology, chip structures are becoming more and more complex, and traditional detection methods are facing huge challenges. XRAY scanning technology, as an efficient and accurate non-destructive detection method, has gradually become one of the key technologies in semiconductor chip quality control. Its main advantage is that it can quickly discover potential defects inside the chip through transmission imaging, thereby effectively improving the quality and reliability of chip production.
XRAY scanning technology can perform high-resolution three-dimensional imaging of chips, accurately capturing solder joints, microcracks, voids, defects and other tiny structural problems that may affect chip performance. This is crucial for early defect detection in the manufacturing process, especially in advanced packaging technology, where XRAY can penetrate deep into the chip and detect problems that are difficult to detect with traditional visual inspection.
In addition, XRAY scanning is not only suitable for finished chips, but is also widely used in various links in the chip production process. For example, in the packaging and testing stages of chips, XRAY scanning can efficiently identify welding problems and packaging defects to avoid chip performance degradation or failure due to poor welding.
Through XRAY technology, manufacturers can conduct a comprehensive inspection of each chip during the production process, thereby improving product qualification rate and reducing rework rate and repair costs. This not only improves production efficiency, but also effectively guarantees the quality of the final product and enhances the market competitiveness of chip manufacturing companies.
