Indstry News-xray equipment;X-RAY detection equipment

X-ray detection equipment XG5010A: equipped with intelligent AI ultra clear algorithm

2025-04-23

In the field of industrial inspection, accurate and efficient defect identification is the key to ensuring product quality. The XG5010A X-ray detection equipment launched by Zhengye Technology innovatively integrates intelligent AI ultra clear algorithm and advanced X-ray transmission technology, redefining the standards of industrial detection and providing a revolutionary solution for quality control in multiple industries. Empowered by intelligent AI algorithms, detection accuracy is further upgradedThe core breakthrough of XG5010A lies in its intelligent AI ultra clear algorithm system:Deep learning defect recognition: automatically recognizes more than 30 common defects including bubbles, cracks, foreign objects, etc., with an accuracy rate of up to 99.7%Adaptive image optimization: AI real-time optimizes imaging parameters, automatically adjusts for different materials and thicknesses, ensuring that all types of products can achieve the best detection resultsIntelligent data analysis: Automatically generate SPC statistical reports, monitor production quality trends in real-time, and warn potential risks in advance The equipment adopts military grade hardware configuration:High precision radiation source: Closed 90KV microfocus radiation source with a minimum focal size of 5 μ m to ensure imaging clarityUltra clear flat panel detector: 1536 × 1536 pixel matrix, pixel size 85 μ m, spatial resolution 5.8lp/mmHigh speed imaging system: With a maximum frame rate of 40fps, it meets the detection requirements of high-speed production linesMulti functional stage: capable of bearing up to 10KG, supporting a standard detection range of 500 × 500mm, with optional special functions such as rotation and tilt XG5010A, with its outstanding performance, has successfully served multiple key industries:In the field of new energy: precise detection of defects such as alignment of lithium battery electrodes and internal wrinkles of battery cellsSemiconductor industry: Identify issues such as micro scale circuit breakage and solder joint virtual soldering inside chipsElectronic manufacturing: comprehensive inspection of PCB board through holes and internal structure of electronic…

Application and advantages of XRAY detection technology in chip manufacturing

2025-04-21

In the process of modern semiconductor chip manufacturing, with the continuous miniaturization of chip structure, traditional detection methods have gradually shown limitations in terms of accuracy, speed and comprehensiveness. Therefore, XRAY (X-ray) detection technology has gradually become an indispensable part of chip manufacturing and quality control. It can use non-destructive detection methods to go deep into the chip and find potential defects, thereby improving the production efficiency and reliability of the chip. XRAY detection technology generates images of the internal structure of the chip by applying X-rays to the chip with its penetrating properties. Compared with traditional two-dimensional microscope detection, XRAY can obtain three-dimensional internal images to help engineers accurately locate tiny defects and welding problems. For example, XRAY can reveal problems such as voids, cracks or poor contact inside the chip package, discover hidden dangers that may affect chip performance in advance, and prevent bad products from entering the market. In addition, XRAY detection is widely used in all aspects of chip manufacturing. In chip