Company News-xray equipment;X-RAY detection equipment

Zhengye Technology CIBF 2025 Battery Exhibition successfully concluded!

2025-05-19

With the highly anticipated 17th Shenzhen International Battery Technology Exhibition CIBF successfully concluded at the Shenzhen International Convention and Exhibition Center (Bao’an), Zhengye Technology is full of honors and gains, and is full of deep gratitude to every customer who visited the booth. This exhibition is not only a brilliant feast in the field of new energy, but also a precious moment for Zhengye Technology to work with global industry partners to jointly plan development blueprints and draw future visions. In this exhibition, as a provider of industrial detection intelligent equipment, Zhengye Technology has fully demonstrated many well-known products and new research and development with its strong R&D strength and deep industry accumulation. During the exhibition, the popularity of Zhengye Technology’s booth continued to rise, and the booth was crowded with people, attracting many domestic and foreign industry professionals to visit and communicate. The staff provided in-depth consulting services to customers who came to visit, answered customer questions in detail, and let customers have a more comprehensive and in-depth understanding of the company’s series of innovative battery technology solutions. Looking to the future, Zhengye Technology will continue to adhere to technological innovation, constantly improve its competitiveness and influence, and contribute more to the development of the industry. We look forward to working hand in hand with more partners to jointly open a new chapter in the field of new energy! Thank you to all customers, partners and friends for your support and love for Zhengye Technology. Let us work together to create a better future!

Zhengye Technology held a summary and commendation meeting for the first quarter of 2025

2025-04-22

On April 18, 2025, Guangdong Zhengye Technology Co., Ltd. (hereinafter referred to as Zhengye Technology) held a summary and commendation meeting for the first quarter of 2025. Yu Xiaobing, Chairman of Zhengye Technology, Fang Zhihua, President, Xu Dihua, Director of the Research Institute, and other company management attended the meeting. The heads of various management units and operating units of Zhengye Technology took turns to make detailed reports on the completion of the work in the first quarter of 2025 and the work plan for the second quarter. Through detailed data and vivid cases, they comprehensively summarized the achievements and shortcomings of the first quarter and clarified the work goals for the second quarter. Chairman Yu Xiaobing, President Fang Zhihua, and Director of the Research Institute Xu Dihua commented on the summary reports of each unit and gave work guidance. Commendation meeting At the beginning of the commendation meeting, all colleagues reviewed the corporate culture together and read the “Zhengye Technology Mission Statement” together. The sonorous and powerful reading showed the spirit of unity, hard work, and mission accomplishment of Zhengye people, and also laid the tone for the conference to move forward. Xu Dihua, director of the institute, gave a comprehensive report on the operation and management of the first quarter and made a comprehensive deployment of key tasks in the second half of the year. Subsequently, the meeting commended the outstanding units in the first quarter of 2025, and the group leaders awarded them certificates of honor, affirming their outstanding contributions in the first quarter. Target Achievement Award Jiangsu Zhengye, Materials Division, Jiyin Technology Nanchang Zhengye, Pengyuwei Technology, Guangyunda Breakthrough Award X-ray Division, Jiyin Technology, Instrument Division Profit Contribution Award Nanchang Zhengye, Jiyin Technology, Instrument Division Speech by representatives of award-winning units Chairman Yu Xiaobing affirmed the efforts…

Using XRAY scanning technology to improve semiconductor chip quality control

2025-04-21

With the continuous advancement of semiconductor chip manufacturing technology, chip structures are becoming more and more complex, and traditional detection methods are facing huge challenges. XRAY scanning technology, as an efficient and accurate non-destructive detection method, has gradually become one of the key technologies in semiconductor chip quality control. Its main advantage is that it can quickly discover potential defects inside the chip through transmission imaging, thereby effectively improving the quality and reliability of chip production. XRAY scanning technology can perform high-resolution three-dimensional imaging of chips, accurately capturing solder joints, microcracks, voids, defects and other tiny structural problems that may affect chip performance. This is crucial for early defect detection in the manufacturing process, especially in advanced packaging technology, where XRAY can penetrate deep into the chip and detect problems that are difficult to detect with traditional visual inspection. In addition, XRAY scanning is not only suitable for finished chips, but is also widely used in various links in the chip production process. For example, in the packaging and testing stages of chips, XRAY scanning can efficiently identify welding problems and packaging defects to avoid chip performance degradation or failure due to poor welding. Through XRAY technology, manufacturers can conduct a comprehensive inspection of each chip during the production process, thereby improving product qualification rate and reducing rework rate and repair costs. This not only improves production efficiency, but also effectively guarantees the quality of the final product and enhances the market competitiveness of chip manufacturing companies.