xray news

Zhengye Technology CIBF 2025 Battery Exhibition successfully concluded!

2025-05-19

With the highly anticipated 17th Shenzhen International Battery Technology Exhibition CIBF successfully concluded at the Shenzhen International Convention and Exhibition Center (Bao’an), Zhengye Technology is full of honors and gains, and is full of deep gratitude to every customer who visited the booth. This exhibition is not only a brilliant feast in the field of new energy, but also a precious moment for Zhengye Technology to work with global industry partners to jointly plan development blueprints and draw future visions. In this exhibition, as a provider of industrial detection intelligent equipment, Zhengye Technology has fully demonstrated many well-known products and new research and development with its strong R&D strength and deep industry accumulation. During the exhibition, the popularity of Zhengye Technology’s booth continued to rise, and the booth was crowded with people, attracting many domestic and foreign industry professionals to visit and communicate. The staff provided in-depth consulting services to customers who came to visit, answered customer questions in detail, and let customers have a more comprehensive and in-depth understanding of the company’s series of innovative battery technology solutions. Looking to the future, Zhengye Technology will continue to adhere to technological innovation, constantly improve its competitiveness and influence, and contribute more to the development of the industry. We look forward to working hand in hand with more partners to jointly open a new chapter in the field of new energy! Thank you to all customers, partners and friends for your support and love for Zhengye Technology. Let us work together to create a better future!

X-ray detection equipment XG5010A: equipped with intelligent AI ultra clear algorithm

2025-04-23

In the field of industrial inspection, accurate and efficient defect identification is the key to ensuring product quality. The XG5010A X-ray detection equipment launched by Zhengye Technology innovatively integrates intelligent AI ultra clear algorithm and advanced X-ray transmission technology, redefining the standards of industrial detection and providing a revolutionary solution for quality control in multiple industries. Empowered by intelligent AI algorithms, detection accuracy is further upgradedThe core breakthrough of XG5010A lies in its intelligent AI ultra clear algorithm system:Deep learning defect recognition: automatically recognizes more than 30 common defects including bubbles, cracks, foreign objects, etc., with an accuracy rate of up to 99.7%Adaptive image optimization: AI real-time optimizes imaging parameters, automatically adjusts for different materials and thicknesses, ensuring that all types of products can achieve the best detection resultsIntelligent data analysis: Automatically generate SPC statistical reports, monitor production quality trends in real-time, and warn potential risks in advance The equipment adopts military grade hardware configuration:High precision radiation source: Closed 90KV microfocus radiation source with a minimum focal size of 5 μ m to ensure imaging clarityUltra clear flat panel detector: 1536 × 1536 pixel matrix, pixel size 85 μ m, spatial resolution 5.8lp/mmHigh speed imaging system: With a maximum frame rate of 40fps, it meets the detection requirements of high-speed production linesMulti functional stage: capable of bearing up to 10KG, supporting a standard detection range of 500 × 500mm, with optional special functions such as rotation and tilt XG5010A, with its outstanding performance, has successfully served multiple key industries:In the field of new energy: precise detection of defects such as alignment of lithium battery electrodes and internal wrinkles of battery cellsSemiconductor industry: Identify issues such as micro scale circuit breakage and solder joint virtual soldering inside chipsElectronic manufacturing: comprehensive inspection of PCB board through holes and internal structure of electronic…

Zhengye Technology held a summary and commendation meeting for the first quarter of 2025

2025-04-22

On April 18, 2025, Guangdong Zhengye Technology Co., Ltd. (hereinafter referred to as Zhengye Technology) held a summary and commendation meeting for the first quarter of 2025. Yu Xiaobing, Chairman of Zhengye Technology, Fang Zhihua, President, Xu Dihua, Director of the Research Institute, and other company management attended the meeting. The heads of various management units and operating units of Zhengye Technology took turns to make detailed reports on the completion of the work in the first quarter of 2025 and the work plan for the second quarter. Through detailed data and vivid cases, they comprehensively summarized the achievements and shortcomings of the first quarter and clarified the work goals for the second quarter. Chairman Yu Xiaobing, President Fang Zhihua, and Director of the Research Institute Xu Dihua commented on the summary reports of each unit and gave work guidance. Commendation meeting At the beginning of the commendation meeting, all colleagues reviewed the corporate culture together and read the “Zhengye Technology Mission Statement” together. The sonorous and powerful reading showed the spirit of unity, hard work, and mission accomplishment of Zhengye people, and also laid the tone for the conference to move forward. Xu Dihua, director of the institute, gave a comprehensive report on the operation and management of the first quarter and made a comprehensive deployment of key tasks in the second half of the year. Subsequently, the meeting commended the outstanding units in the first quarter of 2025, and the group leaders awarded them certificates of honor, affirming their outstanding contributions in the first quarter. Target Achievement Award Jiangsu Zhengye, Materials Division, Jiyin Technology Nanchang Zhengye, Pengyuwei Technology, Guangyunda Breakthrough Award X-ray Division, Jiyin Technology, Instrument Division Profit Contribution Award Nanchang Zhengye, Jiyin Technology, Instrument Division Speech by representatives of award-winning units Chairman Yu Xiaobing affirmed the efforts…

Application and advantages of XRAY detection technology in chip manufacturing

2025-04-21

In the process of modern semiconductor chip manufacturing, with the continuous miniaturization of chip structure, traditional detection methods have gradually shown limitations in terms of accuracy, speed and comprehensiveness. Therefore, XRAY (X-ray) detection technology has gradually become an indispensable part of chip manufacturing and quality control. It can use non-destructive detection methods to go deep into the chip and find potential defects, thereby improving the production efficiency and reliability of the chip. XRAY detection technology generates images of the internal structure of the chip by applying X-rays to the chip with its penetrating properties. Compared with traditional two-dimensional microscope detection, XRAY can obtain three-dimensional internal images to help engineers accurately locate tiny defects and welding problems. For example, XRAY can reveal problems such as voids, cracks or poor contact inside the chip package, discover hidden dangers that may affect chip performance in advance, and prevent bad products from entering the market. In addition, XRAY detection is widely used in all aspects of chip manufacturing. In chip

Using XRAY scanning technology to improve semiconductor chip quality control

2025-04-21

With the continuous advancement of semiconductor chip manufacturing technology, chip structures are becoming more and more complex, and traditional detection methods are facing huge challenges. XRAY scanning technology, as an efficient and accurate non-destructive detection method, has gradually become one of the key technologies in semiconductor chip quality control. Its main advantage is that it can quickly discover potential defects inside the chip through transmission imaging, thereby effectively improving the quality and reliability of chip production. XRAY scanning technology can perform high-resolution three-dimensional imaging of chips, accurately capturing solder joints, microcracks, voids, defects and other tiny structural problems that may affect chip performance. This is crucial for early defect detection in the manufacturing process, especially in advanced packaging technology, where XRAY can penetrate deep into the chip and detect problems that are difficult to detect with traditional visual inspection. In addition, XRAY scanning is not only suitable for finished chips, but is also widely used in various links in the chip production process. For example, in the packaging and testing stages of chips, XRAY scanning can efficiently identify welding problems and packaging defects to avoid chip performance degradation or failure due to poor welding. Through XRAY technology, manufacturers can conduct a comprehensive inspection of each chip during the production process, thereby improving product qualification rate and reducing rework rate and repair costs. This not only improves production efficiency, but also effectively guarantees the quality of the final product and enhances the market competitiveness of chip manufacturing companies.

What products can XRAY testing equipment detect?

2025-04-21

XRAY testing equipment can detect a wide range of products, including but not limited to the following categories: 1. Electronic components: such as IC chips, PCB printed circuit boards, PCBA/SMT/BGA solder joints, lithium batteries, IGBT semiconductors, LED/LCD, etc. 2. Lithium batteries: detect internal defects and effectiveness of batteries, such as positive and negative poles, internal structures, etc. 3. Semiconductor products: such as integrated circuit chips, various components, etc., can detect their internal structures, packaging processes, etc. 4. Metal castings: such as hardware castings, automotive parts, pressure vessels, pipelines, etc., can detect internal welds, cracks and other defects. 5. Plastic materials and parts: can detect cracks, foreign matter and other defects inside plastic parts. 6. Auto parts: such as aluminum castings, tire wheels, etc., to ensure the quality and safety of parts. 7. Other industrial products: such as ceramic products, cables, fixtures, etc., can detect internal cracks, foreign matter and other defects. In addition, XRAY inspection equipment can also be used to detect the welding quality of products, such as identifying BGA welding defects such as empty solder joints and cold solder joints, as well as the structural dimensions and wear conditions of products. In general, XRAY inspection equipment is widely used in the industrial field and can help companies improve product quality and safety.